West Bond designs and manufactures wire bonding and die attach machines, wire pull and shear test equipment, ultrasonic components and related accessories for the microelectronics packaging industry. Established in 1966, the company is best known for its patented single input X-Y-Z micromanipulator. West Bond has headquarters in Anaheim, Calif., and has an additional office in Scotts Valley,...
We manufacture wire bonders, die bonders, die attach, epoxy die attach, pull tester, and shear tester for the semiconductor industry. Levels of automation vary from completely manual to fully automatic.